SEICHITECH Announces RMB 3 Billion Strategic Investment in Shanghai and Shenzhen

Shenzhen, China, March 1,2026— SEICHITECH today announced a major strategic investment of RMB 3 billion to expand its semiconductor test equipment capabilities in Shanghai and Shenzhen.

The company will build a semiconductor memory test equipment R&D and smart manufacturing project in Shenzhen’s Longhua District, as well as a high‑end chip test equipment and cutting‑edge technology R&D center in Shanghai.

The investment follows SEICHITECH’s RMB 300 million commitment to an advanced packaging equipment R&D center in April 2025, marking another strategic step forward in the semiconductor equipment sector.

AI and Advanced Packaging Drive Test Equipment Demand

With the rapid development of AI, demand for high-end chips — including high-performance computing (HPC) chips, AI chips, and high-bandwidth memory (HBM) — is expanding rapidly. At the same time, as Moore’s Law approaches its physical limits, advanced packaging technologies such as 2.5D/3D packaging and Chiplet are placing higher demands on test equipment.

According to SEMI, global semiconductor test equipment sales are expected to surge 48.1% to USD 11.2 billion in 2025.

Meanwhile, the rapid development of XR and smart glasses is driving the industrialization of micro-display technologies such as Micro OLED and LED. IDC data shows that the global AR/VR market is expected to reach USD 39.7 billion between 2024 and 2029, with China growing at a compound annual rate of 41.4% — the world’s fastest-growing market.

Two Core Priorities: Expanding Capacity and Developing High-End Products

SEICHITECH’s strategic investment focuses on two main areas:

1. Expanding production capacity

With rapid growth in the domestic memory industry, customer demand for test equipment has surged. The company plans to build a high-standard smart manufacturing base in Shenzhen’s Longhua District. Once completed, it will enable faster response to customer needs for technology upgrades and capacity expansion, and strengthen China’s independent supply capacity for high-end test equipment.

2. Developing high-end products

SEICHITECH has always maintained an R&D rhythm of “one generation in mass production, one in development, and one in pre-research.” The new R&D projects in Shenzhen and Shanghai are designed to accelerate R&D results, stay close to industry frontiers and customer needs, and build capacity for future technological changes.

The company has laid out several frontier technologies, with three key directions:

• HBM tester R&D — As HBM becomes a key memory form in the AI era, test demand has grown explosively, shifting from sampling to full-depth testing.
• High-performance SoC tester R&D — Targeting complex testing needs for AI chips, GPUs, and other high-performance computing chips, the company is developing targeted solutions to support domestic computing power infrastructure.
• ASIC main control chip R&D — Developing the “brains” of high-end test equipment — proprietary ASICs — to master core technologies, break foreign monopolies, secure supply chain safety, and lead the development of high-end semiconductor test equipment.

Dual-City Strategy Aligns with National Industry Plan

SEICHITECH’s spatial strategy is carefully planned: Shenzhen as the foundation to serve the Greater Bay Area, and Shanghai as the pivot to enter the Yangtze River Delta.

In 2025, Shenzhen’s semiconductor and IC industry exceeded RMB 300 billion for the first time, with the equipment sector reaching RMB 35.6 billion. The city has formed a full-industry-chain ecosystem spanning design, manufacturing, packaging, testing, equipment, and materials. SEICHITECH, deeply rooted in Shenzhen, will leverage regional industrial clusters to further enhance its high-end test equipment capabilities.

Shanghai’s IC industry is expected to exceed RMB 460 billion in 2025, and the city is home to about 40% of China’s IC talent. The new Shanghai R&D center will work closely with customers to form a closed loop of collaborative R&D, iterative verification, and mass production.