Technology Innovations

Driven by self-dependent innovation, we continuously push the boundaries of technology.

Technological innovation /

Driven by self-dependent innovation, we continuously push the boundaries of technology.

Driven by self-dependent R&D, our R&D team continues to grow
- We bring together Ph.D. and master’s graduates in microelectronics, precision instrumentation, optical engineering, software engineering, and other related fields from top universities and research institutes worldwide.
- We actively recruit top industry experts, senior product and marketing professionals, and internationally experienced operations executives.
We have built substantial intellectual property assets and a robust innovation system
- We have established a full‑chain innovation system that covers core technology areas, from basic research to industrial application.
- Integrating industry, academia, research, and application, we have set up a joint research center with Tsinghua University. Working closely with partners across the industrial chain, we are building an open, shared R&D platform.
Building a Systematic Product Matrix, Advancing Multi-Layered Tech Frontiers
- Focusing on Semiconductor Memory Test, Committing to self-developed Core Components.
- Expanding business from DRAM to NAND Flash, and accelerating to enter the SoC test market.
Pursuing a forward‑looking R&D strategy , focusing on next‑generation technologies
- Directly targeting cutting‑edge areas such as AI computing chips, HBM , and Chiplet/3D stacked chips.

Rooted in the Heart of the Semiconductor Industry with a Global Vision

Deeply integrated into domestic industrial clusters and global R&D resources, we build an innovative service platform for semiconductor test and inspection.

Shenzhen Headquarters

Changsha

Hong Kong

Suzhou

Hefei

Nanjing

Wuhan

Shanghai

Electronic System Design

High-Speed Signal Test Technology Precision Fixture Technology High-Capacity Burn-In Chamber Control Technology High-Speed Data Processing Technology
Software Algorithms

DRAM Defect Diagnosis DRAM Repair Algorithm Image Recognition and Feature Extraction Pattern Defect Enhancement and Filtering
Precision Mechanical Automation

High Precision, High Integration, Intelligence High‑Speed Device Transport & Vibration Damping Mechanisms High‑Density MEMS Probe Card Assembly Highly Reliable Alignment and Crimping
Precision Optics

Light Source, Optical Path Design, and Simulation High‑Precision Microscopic Imaging 3D Spectral Confocal Design and R&D of Chromaticity and Luminance Measuring Instruments Gamma Correction and Compensation